Carrier Copper Foil (Peelable Ultra-Thin Copper Foil / DTH ntawv ci)yog cov khoom siv hluav taws xob sib xyaw high-end, tsim los ntawmcov txheej txheem tooj liab + tso tawm txheej txheej + ultra-nyias ua haujlwm tooj liab txheej.
- Carrier txheej: 12 μm / 18 μm / 35 μm txheem electrolytic tooj liab ntawv ci, muab kev txhawb nqa txhua yam kom tsis txhob wrinkling & tawg ntawm ultra-nyias tooj liab thaum lamination.
- Peeling txheej: nano-composite tso tawm mis, ruaj khov tev quab yuam, xoom residue tom qab tshuab stripping nyob rau hauv high-temperature-high-pressure oxygen-dawb lamination tej yam kev mob.
- Cov txheej txheem tooj liab (tso tseg rau ntawm substrate):1.5‑3 μm, ultra-low nto roughness Rz Tsawg dua los yog sib npaug rau 1.5 μm, optimized rau high-frequency high-ceev teeb liab kis tau tus mob.
Tsim los ntawm cov txheej txheem tseem ceeb ntawm electrolytic-carrier: tso nyiaj ultra-nyias tooj liab ntawm electrodeposition / magnetron sputtering nyob rau sab saum toj ntawm cov txheej txheem kho. Tom qab laminating nrog prepreg nyob rau hauv high-temperature-high-pressure, lub tuab carrier ntawv ci yog mechanically peeled tawm; tsuas yog 1.5-3 μm nplua-txheej txheem tooj liab tseem tshuav rau SAP / mSAP semi-additive manufacturing. Nws yog cov khoom tseem ceeb rau kev ruaj khov ntawm cov nplua L / S qis dua 15 μm, yuav luag tsis hloov tau rau high-end IC substrates thiab 1.6T + optical module PCBs.
Thaum tus neeg nqa khoom tooj liab ua tau zoo rau mSAP / SAP ultra-fine kab raug tsim,HVLP Copper Foil vs Carrier Copper Foil: Qhov twg tooj liab ntawv nyiaj yog txoj cai rau 1.6T Optical Modules & AI Server PCB? piav qhia qhov sib txawv tseem ceeb ntawm cov cab kuj tooj liab ntawv nyiaj thiab HVLP ultra-low-profile tooj liab ntawv nyiaj los pab kho vajtse thiab PCB engineers ua kom raug xaiv cov khoom siv sib txawv rau PCB fabrication workflows.
Product Structure & Material Composition
| Txheej | Khoom siv | Thickness | Muaj nuj nqi |
|---|---|---|---|
| Carrier Txheej | Electrolytic tooj liab ntawv ci | 12μm / 18μm / 35μm | Kev txhawb nqa lub cev - tuav cov qauv kev ncaj ncees thiab tiaj tus |
| Tso Txheej Txheej | Hlau + organic sib xyaw | 300nm – 3m | Tswj kev sib khi quab yuam - ua kom huv si, seem - sib cais dawb |
| Ultra-Thin Functional Layer | Electrodeposited tooj liab | 1.5–3μm | Qhov kawg conductive Circuit Court txheej - qis profile kom txo cov nyhuv ntawm daim tawv nqaij |
Khoom Parameter:
Tag nrho thickness:0.012-0.075 hli
Tag nrho qhov dav: <1250 mm
Copper ratio (ntau): 12%–22%
Kev faib khoom
Carrier-Supported Ultra-Thin Copper Foil
Cov neeg nqa khoom muab kev txhawb nqa tshuab rau ultra- txheej txheej tooj liab ua haujlwm zoo thaum tuav, lamination thiab ua haujlwm.
Qhov kev teeb tsa no muaj txiaj ntsig tshwj xeeb thaum xav tau tooj liab nyias nyias tab sis ncaj qha tuav ntawm ib qho dawb - sawv ultra- ntawv ci nyias yuav nyuaj.
mSAP Copper Ntawv Nyiaj
Tsim los rauHloov Kho Ib nrab-Txoj Haujlwm Ntxiv (mSAP)daim ntaub ntawv, qhov twg ib txheej tooj liab nyias ua haujlwm raws li cov txheej txheem pib ua ntej ntxiv tooj liab plated los tsim cov qauv hauv Circuit Court.
mSAP feem ntau cuam tshuam nrog high -kev tsim hluav taws xob ceev thiab nplua - cov ntawv thov kab. Cov ntawv pov thawj kev lag luam piav qhia cov neeg nqa khoom-txhawb foils tshwj xeeb rau mSAP IC substrates thiab HDI / SLP daim ntawv thov.
SAP Copper Ntawv Nyiaj
RauSemi-Cov Txheej Txheem Ntxiv (SAP)daim ntawv thov yuav tsum tau tswj tooj liab thickness thiab nto yam ntxwv haum rau zoo qauv tsim.
Ultra-thin copper foils nyob rau hauv kwv yees li 1.5-3 μm ntau yam yog siv los ua lag luam rau SAP/MSAP zoo- daim ntawv thov qauv.
Zoo- Kab PCB Copper Foil
Lub ultra- txheej txheej tooj liab ua haujlwm tau zoo pab txo cov tooj liab uas yuav tsum tau muab tshem tawm thaum lub sij hawm Circuit Court txhais, txhawb nqa zoo - kab thiab siab - ntom PCB tsim.
IC Substrate Copper Foil
Haum rau cov pob ntawv qib siab substtus nqi uas zoo- suab sib cuam tshuam, microvias thiab siab -nrhiav kev ceev yog qhov tsim nyog tsim nyog.
Khoom Specifications
| Yam khoom | Parameter Reference |
|---|---|
| Khoom npe | Carrier Copper Foil / Peelable Ultra-Thin Copper Foil |
| Muaj nuj nqi tooj liab Thickness | 1.5 μm / 2 μm / 3 μm (kev cai muaj) |
| Carrier tooj liab Thickness | 12 μm /18 μm /35 μm |
| Tag nrho Thickness Range | 0.012-0.075 hli |
| Max dav | Tsawg dua los yog sib npaug li 1250 mm |
| Copper Mass Ratio | 12%‑22% |
| Nto Roughness | Rz Tsawg dua los yog sib npaug rau 1.5 μm (tsawg-profile rau high-frequency) |
| Txheej txheem Compatibility | mSAP / SAP semi-additive txheej txheem |
| Lamination condition | High-temperature, high-pressure, tsis muaj oxygen |
| Circuit Court muaj peev xwm | Fine line-space down mus rau 10 μm L / S |
| Daim ntawv | Roll-to-roll coil, ib sab / ob sab sib xyaw |
Peb Cov Txheej Txheem Technology Barriers
Carrier tooj liab ntawv nyiaj muaj peb qhov kev cuam tshuam loj uas txiav txim siab cov khoom zoo:
1. Uniform deposition ntawm ultra- txheej tooj liab nyias.Thickness yuav tsum tau tswj nyob rau hauv1.5–3μm- nyuaj heev rau kev tsim khoom tsis tu ncua.
2. Precise tswj ntawm tev quab yuam.Peel quab yuam yuav tsum yogruaj khov thiab tswj tau. Tsawg heev, thiab cov cab kuj tawm ntxov ntxov. Siab dhau, thiab nws tsis tuaj yeem tev. Peel nto yuav tsum yogtiaj thiab tsis puas.
3. Kev txo qis heev ntawm qhov roughness.Cov txheej txheej ultra- nyias yuav tsum tau tswjQhov chaw qis heev (Rz Tsawg dua lossis sib npaug li 1.5μm)ntawm nyias nyias thickness - kom ua tau siab - zaus, siab -kev ua tau zoo.
Tej kev siv
- IC Ntim Substrates:BT substrates (nco chips), ABF substrates (CPU/GPU) - cov khoom siv tooj liab yog ib qhoxav tau cov ntaub ntawv. Raws li AI chips xav tau I / O ceev dua, FCBGA ntim substrates tau txav mus rau ultra- cov kab zoo.
- High -Speed Optical Modules:Hauv1.6T thiab 3.2Toptical modules, PCB txheej txheem hloov ntawm HDI mus rau mSAP - cab kuj tooj liab ntawv ci yogxav taurau siab -ntaus teeb liab sib cuam tshuam.
- Substrate-Zoo li PCB (SLP):SLP kab dav / qhov sib nrug ntog ntawm ib txwm PCB thiab IC substrates - siv hauvsiab -kawg smartphones (piv txwv li, iPhone) thiab cov khoom siv foldable.
- AI Server:Carrier tooj liab ntawv ci yog siv nyob rau hauvAI server PCB thiab siab -ceev backplanes.
Tsis paub meej tias cov khoom siv tooj liab lossis HVLP tooj liab ntawv nyiaj puas yog rau koj daim ntawv thov? Nyeem tag nrhoHVLP vs carrier tooj liab foil phau ntawv qhiaua ntej, ces paub meej tias koj specification hauv qab no.
Kev lag luam thiab kev xa khoom
| Yam khoom | Paub meej |
|---|---|
| Yam tsawg kawg nkaus Order Quantity | Qauv yob: 5-20 sqm; Kev tsim khoom loj: sib tham |
| Nqe Basis | Nqe lus ib square meter (cov khoom siv, tsis yog tooj liab xwb) |
| Cov nqe lus muaj nqi | EX-W, FOB (Shanghai, Qingdao lossis lwm qhov chaw nres nkoj Tuam Tshoj), CFR, CIF |
| Cov nqe lus them nqi | T / T (30% tso nyiaj, tshuav nyiaj li cas ua ntej xa khoom); Irrevocable L / C thaum pom rau qhov ntim loj |
| Qauv Kev Pabcuam | Engineering qauv muaj; buyer bears nqi freight |
| Lub Sijhawm Lead | Qauv: 7-14 hnub ua haujlwm; Kev tsim khoom loj: 30-45 hnub ua haujlwm tom qab tau txais qhov tso nyiaj |
| Ntim | Dust-proof, noo noo-pov thawj lub tshuab nqus tsev coil ntim, seaworthy export thawv / ntoo rooj plaub |
| Kev tshuaj xyuas | Factory Internal Dimension, roughness, tev-force test; Cov ntaub ntawv xeem thib peb muaj nyob rau ntawm qhov kev thov |
Vim li cas thiaj xaiv peb - Tuam Tshoj Chaw Muag Khoom Nrog Carrier Foil Processing Capability
- Kev ua raws li mSAP/SAP tag nrho.Txhua qhov khoom xa tuaj suav nrog abatch-Specific Mill Test Certificatenrog rau qhov tseeb ultra-nyias foil thickness, carrier thickness, tev lub zog, thiab cov ntaub ntawv roughness.
- Stable tso txheej tshuab.Carrier peelstom qab laminationtab sis tsis ua ntej. Tso lub zog tswj rauhuv si sib cais.
- Tsis muaj residue, tsis muaj pinholes.Ultra-thin tooj liab nto dawb los ntawmtooj liab hmoov thiab tso tawm txheej residue.
- Ultra{0}} nyias nyias muaj peev xwm. 1.5–3μmultra- txheej tooj liab nyias muaj.
- Dav yob hom.Rollsdav li 1,250 mmrau siab productivity.
- Kev xa khoom sai ntawm Tshuag.Standard sizes nkoj hauv7-15 hnub; kev cai qhov ntau thiab tsawg tau lees paub ntawm kev txiav txim xyuas.
- Kev txhawb nqa rau mSAP kev koom ua ke.Xa peb koj cov kab dav, hom substrate, thiab lamination profile - peb yuav pom zoo rau cov khoom siv foil txoj cai.
Xav Tau Carrier Copper Foil rau Koj mSAP/SAP, IC Substrate, lossis AI Server Application?
Xa koj lub hom phiaj specification (functional Cu thickness, carrier thickness, dav, phiaj daim ntawv thov: IC-sub / optical-module / SLP) los ntawm kev nug. Peb pab neeg muag khoom yuav teb tsis pub dhau 24 teev ua haujlwm thiab muab cov lus hais thiab txhawb nqa cov ntaub ntawv xeem.
Los yogtiv tauj peb pab neeg technicalnrog rau koj txoj kab dav, hom substrate, thiab lamination profile - peb yuav pom zoo kom cov cab kuj yog cov ntaub ntawv zoo rau koj tus qauv tsim.
Tshawb xyuas peb lwm cov khoom siv tooj liab → Nickel Plated Copper Ntawv Nyiaj | Microporous Copper Ntawv Nyiaj| Ultra Nyias Copper Foil | HVLP Copper Foil vs Carrier Copper Foil
FAQ
Q1: Cov khoom siv tooj liab siv rau dab tsi?
A: Carrier tooj liab ntawv ci yog siv raumSAP/SAP zoo- kab PCB, IC substrates (BT thiab ABF), AI server PCB, 1.6T + optical modules, thiab SLP (Substrate-Zoo li PCB). Nws yog tustsuas yog cov khoom siv tooj liab uas tuaj yeem ruaj khov ua tiav ultra- kab hauv qab 15μm.
Q2: Dab tsi yog cov qauv ntawm cov cab kuj tooj liab ntawv?
A: Cov qauv yog apeb -layer composite: txheej txheej (12–35μm electrolytic tooj liab ntawv ci) + tso tawm txheej + ultra- txheej txheej tooj liab nyias (1.5-3μm). Tus neeg nqa khoom muab kev txhawb nqa lub cev. Cov txheej txheem tso tawm tswj kev sib raug zoo. Lub ultra{10}} txheej nyias yog qhov kawg conductive circuit.
Q3: Yuav ua li cas cov khoom siv tooj liab tiv thaiv kev puas tsuaj?
A: Ultra-thin copper foil (tsawg dua lossis sib npaug li 3μm) muajmechanical zog tsawg. Tsis muaj tus cab kuj, nwswrinkles, kua muag, thiab sothaum lub sij hawm lamination. Tus neeg nqa khoom muabmechanical kev them nyiaj yuglos ntawm cov txheej txheem lamination - raising txheej txheem tawm los ntawmqis dua 50% mus rau saum 90%.
Q4: Thaum twg tus cab kuj raug tshem tawm?
A: Tus cab kuj yogtsis tev ua ntej laminationmus rau lub substrate. Nwstuaj yeem tev tau tom qab lamination. Qhov no tiv thaiv tev ntxov ntxov thaum tuav.
Q5: Puas yog cov txheej txheem tso tawm cov khoom seem?
A: Tsis yog. Tom qab tev, lub ultra-thin copper foil nto yoghuv si thiab tsis puas- dawb los ntawm tooj liab hmoov thiab tso tawm txheej residue.
Q6: Dab tsi yog qhov muaj ultra-thin foil thicknesses?
A: Ultra-thin foil thickness ranges los ntawm1.5m mus 3m. Qhov no enables10μm los yog finer kab dav / nrug (L / S).
Q7: Vim li cas tus cab kuj tooj liab ntawv nqi ib square meter?
A: Vimtsis tshua muaj siab technical barriers, carrier tooj liab foil pricing yogtsis yog "tus nqi tooj liab + nqi ua haujlwm"- yogtus nqi ib square meter, nrog tsis tshua muaj siab technical premium thiab tag nrho cov paj.
Q8: Dab tsi yog qhov roughness ntawm cov khoom siv tooj liab?
A: Ultra- txheej txheej txheej txheem ua haujlwm tau zooRz Tsawg dua lossis sib npaug li 1.5μm- zoo suppressing cov nyhuv ntawm daim tawv nqaij thiab txo qhov tsis zoo rauAI server thiab siab - cov ntawv thov zaus.
Q9: Dab tsi yog qhov txawv ntawm cov khoom siv tooj liab thiab cov ntawv electrolytic tooj liab zoo tib yam?
A: Carrier tooj liab ntawv ci yog peb-txheej sib xyaw qauv nrog tso tawm txheej txheej. Tom qab lamination lub tuab cov cab kuj raug tshem tawm, tsuas yog 1.5-3 μm ua haujlwm tooj liab. Ordinary copper foil tsis tuaj yeem txhawb kev ruaj khov zoo-kab (<15 μm L/S) mSAP/SAP production and suffers low yield for ultra‑thin‑foil handling.
Q10: Dab tsi thicknesses muaj?
A: Nyob ntawm cov khoom qib, kev ua haujlwm tooj liab tuab tuaj yeem muab rau hauv ultra- cov ntsuas me me xws li kwv yees li 1.5 μm, 2 μm, 3 μm thiab 5 μm. Muaj tseeb yuav tsum tau lees paub rau txhua qhov project.
Q11: Puas yog cov khoom siv tooj liab haum rau IC substrates?
A: Yog. Nws yog tshwj xeeb tshaj yog muaj feem xyuam rau siab - ntom IC substrate manufacturing qhov twg nyias tooj liab thiab nplua - kab hluav taws xob tsim yuav tsum tau.
Q12: Koj puas tuaj yeem muab 1.5 μm tooj liab ntawv ci?
A: 1.5 μm ua haujlwm tooj liab yog ib qho kev tsim cov thickness ntau rau kev nplua -patterning tooj liab ntawv ci khoom. Muaj yuav tsum tau lees paub raws li tus neeg nqa khoom xav tau, kev kho saum npoo thiab ntau lawm specification.
Q3: Cov cab kuj thickness tuaj yeem kho tau?
A: Carrier thickness, functional foil thickness, dav thiab lwm yam tsis tuaj yeem tham raws li cov txheej txheem tsim khoom thiab cov khoom siv.
Cim npe nrov: cab kuj tooj liab ntawv nyiaj, tus neeg nqa khoom tooj liab ntawv nyiaj, 1.5-3μm ultra-thin peelable tooj liab rau mSAP/SAP, IC substrates, AI server, 1.6T optical modules. Kev tso tawm ruaj khov, tsis muaj residue.C substrate tooj liab ntawv ci xa khoom sai los ntawm Tuam Tshoj.
